Structural Characteristics and Improved Thermal Stability of HDPE/Calcium Pimelate Nanocomposites

Author:

Samiotaki Christina1ORCID,Tarani Evangelia2ORCID,Karavasili Dimitra1,Zamboulis Alexandra1ORCID,Chrissafis Konstantinos2,Bikiaris Dimitrios N.1ORCID

Affiliation:

1. Laboratory of Chemistry and Technology of Polymers and Dyes, Department of Chemistry, Aristotle University of Thessaloniki, 54124 Thessaloniki, Greece

2. Laboratory of Advanced Materials and Devices, Department of Physics, Aristotle University of Thessaloniki, 54124 Thessaloniki, Greece

Abstract

In the present research work, calcium pimelate (CaPim) was synthesized and investigated as an additive for high-density polyethylene (HDPE). HDPE/CaPim nanocomposites were prepared by melt-mixing, with CaPim content ranging from 0.1% to 1%, affording white homogeneous materials. The chemical structure of the nanocomposites and the incorporation of CaPim was confirmed by infrared spectroscopy. The surficial morphology and the additive distribution were examined by scanning electron microscopy. Differential scanning calorimetry and X-ray diffraction measurements showed that the thermal transitions and crystal structure of HDPE are not affected by the incorporation of CaPim, while the mechanical properties are retained overall. This study focuses on the thermal degradation of HDPE nanocomposites, investigating the degradation mechanism and kinetic parameters through various analytical methods. Isoconversional techniques, including the Friedman method, Vyazovkin analysis, and Ozawa Flynn Wall analysis, were employed to calculate activation energies (Eα). The degradation mechanism and kinetic triplet were determined based on a multivariate non-linear regression method (model-fitting). Finally, the presence of a CaPim additive was shown to increase the Eα of thermal degradation, consistent with the calculated dependence of Eα on the degree of conversion and the improved thermal stability of the HDPE matrix.

Funder

the European Union’s Horizon Europe Framework Programme

Publisher

MDPI AG

Subject

Computer Networks and Communications,Hardware and Architecture,Software

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