Maximizing Roughness Factors in Oxide-Derived Copper Coatings through Electrodeposition Parameters for Enhanced Electrocatalytic Performance

Abstract

The pursuit of novel techniques for obtaining dispersed copper-based catalysts is crucial in addressing environmental issues like decarbonization. One method for producing nanostructured metals involves the reduction of their oxides, a technique that has found widespread use in CO2 electroreduction. Currently, the intrinsic activities of oxide-derived copper electrocatalysts produced via different routes cannot be compared effectively due to the lack of information on electrochemically active surface area values, despite the availability of electrochemical methods that enable estimation of surface roughness for highly dispersed copper coatings. In this study, we aim to explore the potential of oxide-derived copper to achieve a high electrochemically active surface area by examining samples obtained from acetic and lactic acid deposition solutions. Our results revealed that Cu2O oxides had distinct morphologies depending on the electrodeposition solution used; acetate series samples were dense films with a columnar structure, while electrodeposition from lactic acid yielded a fine-grained, porous coating. The roughness factors of the electroreduced films followed linear relationships with the deposition charge, with significantly different slopes between the two solutions. Notably, a high roughness factor of 650 was achieved for samples deposited from lactic acid solution, which represents one of the highest estimates of electrochemically active surface area for oxide-derived copper catalysts. Our results highlight the importance of controlling the microstructure of the electrodeposited oxide electrocatalysts to maximize surface roughness.