Effects of Water Cooling on the Microstructure of Electron Beam Additive-Manufactured Ti-6Al-4V

Author:

Panin AlexeyORCID,Martynov Sergey,Kazachenok Marina,Kazantseva Lyudmila,Bakulin Alexander,Kulkova Svetlana,Perevalova Olga,Sklyarova Elena

Abstract

The inferior mechanical properties of EBAM Ti-6Al-4V samples are due to the coarse columnar grains containing coarse lamellar structures. One can expect that water cooling of the build platform will increase the cooling rate of the molten pool during the build-up process, causing microstructure refinement. In the present work, the substrate cooling effects on the microstructure and phase composition of EBAM Ti-6Al-4V samples are studied using optical, scanning electron, and scanning transmission microscopy, as well as X-ray diffraction analysis. It is shown that the microstructure of the EBAM Ti-6Al-4V samples built on the substrate without water cooling consists predominantly of columnar prior β grains with lateral sizes ranging up to 2000 µm, while cooling of the build platform causes the appearance of equiaxed prior β grains measuring 1000 µm. Moreover, the refinement of the martensite structure and the precipitation of α′′ martensite platelets within α laths occur in the EBAM Ti-6Al-4V samples built on the water-cooled build platform. An explanation of the mechanisms underlying the α′→α + β and α′→α + α′′ + β transformations during the building process is provided based upon ab initio calculations. The fragmentation of the α laths under the residual compressive stresses is discussed.

Funder

Russian Science Foundation

Publisher

MDPI AG

Subject

General Materials Science,Metals and Alloys

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3