Validation and Calibration of Maize Seed–Soil Inter-Parameters Based on the Discrete Element Method

Abstract

An appropriate contact mechanics model and parameters are key to achieving accurate results in discrete element analyzis. This is necessary to predict the process of contact collision between the soil and maize seed during deposition. In this paper, the contact process between maize seed and soil is analyzed using the maize seed variety (Liangyu 99) and maize-sowing field soil (with three different moisture contents) as research objects. Based on this, the contact process between maize seeds and soil has been analyzed, on the basis of which a mechanical model suitable for simulating the contact process between maize seeds and soil has been explored, and the selection of parameters between heterogeneous particles (maize seed and soil particles) has been investigated. The results showed that adhesion forces have a significant effect on the collision process between seed and soil particles. While the presence of tangential adhesion force can be replaced by increasing the static and rolling friction coefficients, the normal adhesion force cannot be compensated in this way. The Edinburgh Elasto-Plastic Adhesive (EEPA) model is selected in this paper to describe the contact between seed and soil particles. The significance of the input parameters in the EEPA model is investigated using the Plackett–Burman test. The parameters between soil and seed particles are optimized using the central composite design, and the optimal parameter combinations are obtained. The relative error between the simulation and test result of the slope test for the three soil moisture contents is within 5.4%, validating the accuracy of the calibrated parameters.