Co-Design of Mechanical and Vibration Properties of a Star Polygon-Coupled Honeycomb Metamaterial

Author:

Yong Jiawang1,Li Wanting1,Hu Xiaojun2ORCID,Wan Zhishuai3,Dong Yiyao1,Feng Nenglian1

Affiliation:

1. Department of Traffic Engineering, Beijing University of Technology, Beijing 100124, China

2. School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, Beijing 100044, China

3. Beijing Key Laboratory of Lightweight Multi-Functional Composite Materials and Structures, Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China

Abstract

Based on the concept of component assembly, a novel star polygon-coupled honeycomb metamaterial, which achieves a collaborative improvement in load-bearing capacity and vibration suppression performance, is proposed based on a common polygonal structure. The compression simulation and experiment results show that the load-bearing capacity of the proposed metamaterial is three times more than that of the initial metamaterial. Additionally, metal pins are attached and particle damping is applied to the metamaterial to regulate its bandgap properties; the influence of configuration parameters, including the size, number, position, and material of the metal pins, on bandgaps is also investigated. The results show that the bandgap of the proposed metamaterial can be conveniently and effectively regulated by adjusting the parameters and can effectively suppress vibrations in the corresponding frequency band. Particle damping can be used to continuously adjust the frequency of the bandgap and further enhance the vibration suppression capacity of the metamaterial in other frequency bands. This paper provides a reference for the design and optimization of metamaterials.

Funder

National Natural Science Foundation of China

Beijing Natural Science Foundation

State Key Laboratory of Automotive Safety and Energy

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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