Test and Analysis of the Heat Dissipation Effect of the Spindle Heat Conductive Path Based on the IPTO Algorithm-Reference-Cited by-同舟云学术

Test and Analysis of the Heat Dissipation Effect of the Spindle Heat Conductive Path Based on the IPTO Algorithm

Published:2023-12-19 Issue:1 Volume:12 Page:4
ISSN:2227-9717
Container-title:Processes
language:en
Short-container-title:Processes

Author:

Li Yang¹^ORCID,Liu Zhongting²,Li Lei²,Tian Jingyao²^ORCID,Hou Zhaoyang²,Zhao Wanhua¹,Wu Wenwu³

Affiliation:

1. State Key Laboratory for Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710054, China

2. School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710054, China

3. Key Lab of NC Machine Tools and Integrated Manufacturing Equipment of the Education Ministry & Key Lab of Manufacturing Equipment of Shaanxi Province, Xi’an 710048, China

Abstract

In this paper, in order to reduce the spindle temperature rise and enhance the spindle heat dissipation capability, a top complementary heat conductive path of the spindle based on the IPTO algorithm was designed. In order to verify the heat dissipation effect of the heat conductive path, an experimental test platform was constructed. Experiments on the thermal characteristics of water-cooled and air-cooled heat conductive paths with different volume proportions were conducted to test the temperature rise of the spindle and analyze the effect of the heat conductive path with different volume proportions on the temperature distribution of the spindle. The heat conductive path with the optimal volume proportion was determined and the heat dissipation effect of the heat conductive path was verified.

Funder

National Natural Science Foundation of China

National Natural Science Foundation of Shaanxi Province

Key-Area Research and Development Program of Guangdong Province Grant

Publisher

MDPI AG

Subject

Process Chemistry and Technology,Chemical Engineering (miscellaneous),Bioengineering

Link

https://www.mdpi.com/2227-9717/12/1/4/pdf

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