Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes-Reference-Cited by-同舟云学术

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Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes

Published:2017-03-22 Issue:3 Volume:10 Page:323
ISSN:1996-1944
Container-title:Materials
language:en
Short-container-title:Materials

Author:

Schiavone Giuseppe,Murray Jeremy,Perry Richard,Mount Andrew,Desmulliez Marc,Walton Anthony

Funder

Engineering and Physical Sciences Research Council

Publisher

MDPI AG

Subject

General Materials Science

Link

http://www.mdpi.com/1996-1944/10/3/323/pdf

Reference53 articles.

1. Design of microfabricated transformers and inductors for high-frequency power conversion

2. Development of electroplated magnetic materials for MEMS

3. Review of Integrated Magnetics for Power Supply on Chip (PwrSoC)

4. Effects of Process Conditions on Properties of Electroplated Ni Thin Films for Microsystem Applications

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Magnetization Switching Dynamics of Electrodeposited Fe–Ni Thin Films;Journal of Superconductivity and Novel Magnetism;2024-05-27

2. Electrodeposited magnetic nanoporous membrane for high-yield and high-throughput immunocapture of extracellular vesicles and lipoproteins;Communications Biology;2022-12-10

3. From Hetch Hetchy to the Cuyahoga: How Rivers Shaped the American Environmental Movement;The Professional Geographer;2020-09-23

4. Electrochemical Deposition of NiFe Alloy at a Temperature of 70°C;Russian Journal of Electrochemistry;2020-07

5. An investigation on FR4 as a based material for Ti/Au and Cu/Au evaporated fabrication for DNA biosensor application;Journal of Physics: Conference Series;2020-05-01

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