Equity, Diversity, and Inclusion Strategies in Engineering and Computer Science

Author:

Amer Adan1ORCID,Sidhu Gaganpreet1,Alvarez Maria Isabel Ramirez2,Ramos Juan Antonio Lopez2,Srinivasan Seshasai1ORCID

Affiliation:

1. W Booth School of Engineering Practice and Technology, McMaster University, Hamilton, ON L8S 4L8, Canada

2. Department of Mathematics, University of Almeria, 04120 Almeria, Spain

Abstract

This article delves into the issues of equity, diversity, and inclusiveness (EDI) in the engineering disciplines in Canada and Spain and presents the challenges faced by underrepresented individuals and ways to promote an inclusive and diverse environment. Two strategic lines are identified: (a) facilitating university education access to underrepresented and minority groups and (b) guiding such students during university training to set them up for successful future careers. Accordingly, this article shows how the strategies mentioned above are implemented in some selected Canadian and Spanish universities, clearly distinguishing the approach taken in the two countries. In Canada, there is a more decentralized approach to addressing EDI issues, wherein the universities devise their agendas independently. In Spain, on the other hand, there is a stronger and more direct involvement of the government to ensure a comprehensive, system-wide approach to tackling EDI issues in academia. This article helps education policymakers to devise and implement pragmatic strategies for achieving EDI and the relevant UN-defined sustainable development goals.

Publisher

MDPI AG

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3