Damage Detection for Rotating Blades Using Digital Image Correlation with an AC-SURF Matching Algorithm

Author:

Gu Jiawei,Liu GangORCID,Li Mengzhu

Abstract

The motion information of blades is a key reflection of the operation state of an entire wind turbine unit. However, the special structure and operation characteristics of rotating blades have become critical obstacles for existing contact vibration monitoring technologies. Digital image correlation performs powerfully in non-contact, full-field measurements, and has increasingly become a popular method for solving the problem of rotating blade monitoring. Aiming at the problem of large-scale rotation matching for blades, this paper proposes a modified speeded-up robust features (SURF)-enhanced digital image correlation algorithm to extract the full-field deformation of blades. Combining an angle compensation (AC) strategy, the AC-SURF algorithm is developed to estimate the rotation angle. Then, an iterative process is presented to calculate the accurate rotation displacement. Subsequently, with reference to the initial state of rotation, the relative strain distribution caused by flaws is determined. Finally, the sensitivity of the strain is validated by comparing the three damage indicators including unbalanced rotational displacement, frequency change, and surface strain field. The performance of the proposed algorithm is verified by laboratory tests of blade damage detection and wind turbine model deformation monitoring. The study demonstrated that the proposed method provides an effective and robust solution for the operation status monitoring and damage detection of wind turbine blades. Furthermore, the strain-based damage detection algorithm is more advantageous in identifying cracks on rotating blades than one based on fluctuated displacement or frequency change.

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

National Natural Science Foundation of Chongqing

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

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