Microstructure Evolution in a Fast and Ultrafast Sintered Non-Equiatomic Al/Cu HEA

Author:

Reverte EduardoORCID,Cornide Juan,Lagos Miguel A.,Campos MónicaORCID,Alvaredo PaulaORCID

Abstract

One of the attractive characteristics of high entropy alloys (HEAs) is the ability to tailor their composition to obtain specific microstructures and properties by adjusting the stoichiometry to obtain a body-centered cubic (BCC) or face-centered cubic (FCC) structure. Thus, in this work, the target composition of an alloy of the FeCrCoNi family has been modified by adjusting the Al/Cu ratio in order to obtain a BCC crystalline structure. However, processing conditions always play a key role in the final microstructure and, therefore, in this work, the microstructure evolution of FeCrCoNiAl1.8Cu0.5 HEA sintered by different powder metallurgy (PM) techniques has been investigated. The techniques used range from the conventional PM sintering route, that uses high heating rates and sintering times, going through a fast sintering technique such as spark plasma sintering (SPS) to the novel and promising ultrafast sintering technique electrical resistance sintering (ERS). Results show that the increase in the processing time favours the separation of phases and the segregation of elements, which is reflected in a substantial change in the hardness of the alloy. In conclusion, the ERS technique is presented as a very promising consolidation technique for HEA.

Funder

Spanish Ministry of Science and Innovation

Comunidad de Madrid

Publisher

MDPI AG

Subject

General Materials Science,Metals and Alloys

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3