Reliability Assessment of Statistical Distributions for Analyzing Dielectric Breakdown Strength of Polypropylene

Author:

Park Keon-Hee1ORCID,Lee Seung-Won2ORCID,Kim Hae-Jong2,Lim Jang-Seob1

Affiliation:

1. Division of Marine Mechatronics, Mokpo National Maritime University, Mokpo-si 58654, Republic of Korea

2. Power Cable Research Center, Korea Electrotechnology Research Institute, Changwon-si 51543, Republic of Korea

Abstract

Various statistical distributions, such as Weibull, log-normal, and exponential functions, are frequently employed to interpret the dielectric breakdown (BD) strength data of insulating materials, including cross-linked polyethylene, low-density polyethylene, polypropylene (PP), and polyethylene. This study aimed to determine a suitable statistical distribution for analyzing the dielectric BD strength data of PP insulators before and after thermal degradation. Dielectric BD strength tests were conducted on thermally deteriorated PP insulators under various degradation conditions. Additionally, a coefficient of determination was employed to assess the compatibility between the dielectric BD strength data and the statistical distribution of PP insulators before and after thermal degradation. The test results indicate that the coefficient of determination for alternating current BD strength data was 0.955 in the log-normal distribution before degradation and 0.929 in the Weibull distribution after degradation. Consequently, in the analysis of the PP insulation breakdown data, the log-normal distribution was found to be suitable for data before degradation, while the Weibull distribution was deemed suitable for data after degradation. These results can lead to lower errors in the power system design process, enhancing reliability when analyzing the BD strength data of insulation materials.

Funder

Korea Electrotechnology Research Institute (KERI) Primary research program

National Research Council of Science and Technology

Ministry of Science and ICT

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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