Parametric Investigation of Parallel Deposition Passes on the Microstructure and Mechanical Properties of 7075 Aluminum Alloy Processed with Additive Friction Stir Deposition

Author:

Cahalan L. P.12,Williams M. B.12ORCID,Brewer L. N.3,McDonnell M. M.4ORCID,Kelly M. R.4,Lalonde A. D.4,Allison P. G.12ORCID,Jordon J. B.12

Affiliation:

1. Point-of-Need Innovations (PONI) Center, Baylor University, Waco, TX 76704, USA

2. Department of Mechanical Engineering, Baylor University, Waco, TX 76704, USA

3. Department of Metallurgical Engineering, The University of Alabama, Tuscaloosa, AL 35487, USA

4. U.S. Army DEVCOM Ground Vehicles System Center (GVSC), Warren, MI 48092, USA

Abstract

Large-scale metal additive manufacturing (AM) provides a unique solution to rapidly develop prototype components with net-shape or near-net shape geometries. Specifically, additive friction stir deposition (AFSD) is a solid-state method for large-scale metal AM that produces near-net shape depositions capable of high deposition rates. As AFSD is utilized for a broader range of applications, there is a need to understand deposition strategies for larger and more complex geometries. In particular, components with larger surface areas will require overlapping deposition passes within a single layer. In this study, the AFSD process was used to create depositions utilizing multiple passes with a varying deposition path overlap width. The effects of overlapping parallel pass depositions on the mechanical and microstructural properties of aluminum alloy 7075 were examined. The grain size and microstructural features of the deposited material were analyzed to evaluate material mixing and plastic flow in the observed overlap regions. Additionally, hardness and tensile experiments were conducted to observe the relationship between the overlap width and as-deposited material behavior. In this study, an ideal overlap width was found that produced acceptable as-deposited material properties.

Funder

US Army Combat Capabilities Development Command (DEVCOM) Ground Vehicle System Command

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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