Phase Equilibria of the Ag-Al-Au Ternary System and Interfacial Reactions in the Au-xAg/Al Couples at 450 °C
-
Published:2023-11-16
Issue:22
Volume:16
Page:7196
-
ISSN:1996-1944
-
Container-title:Materials
-
language:en
-
Short-container-title:Materials
Author:
Ramadhani Mavindra1, Laksono Andromeda Dwi1ORCID, Liang Chien-Lung1ORCID, Yang Chiao-Yi1, Chen Kuo-Jung1, Yen Yee-Wen12ORCID, Hsiao Hsien-Ming3
Affiliation:
1. Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10633, Taiwan 2. Sustainable Electrochemical Energy Development Center (SEED Center), National Taiwan University of Science and Technology, Taipei 10633, Taiwan 3. National Atomic Research Institute, Taoyuan 32546, Taiwan
Abstract
The phase equilibria of the Ag-Al-Au ternary system and the solid-state reaction couple for the Au-xAg/Al system were investigated isothermally at 450 °C. By investigating the Ag-Al-Au ternary system and its isothermal section, this study aims to provide a clearer understanding of the phase stability and interfacial reactions between different phases. This information is crucial for designing materials and processes in electronic packaging, with the potential to reduce costs and improve reliability. There were seven single-phase regions, thirteen two-phase regions, and six three-phase regions, with no ternary intermetallic compound (IMC) formed in the isothermal section of the Ag-Al-Au ternary system. When the Au-25 wt.% Ag/Al couple was aged at 450 °C for 240–1500 h, the AuAl2, Au2Al, and Au4Al phases formed at the interface. When the Ag contents increased to 50 and 75 wt.%, the Ag2Al, AuAl2, and Au4Al phases formed at the interface. When the aging time increased from 240 h to 1500 h, the total IMC thickness in all Au-xAg/Al couples became thicker, but the types of IMCs formed at the interface did not change. The total IMC thickness also increased with the increase in the Ag content. When the Ag content was greater than 25 wt.%, the Au2Al phase was converted into the Ag2Al phase. The IMC growth mechanism in all of the couples followed a reaction-controlled process.
Funder
National Science and Technology Council, Taiwan Ministry of Education of Taiwan (the Sustainable Electrochemical Energy Development Center
Subject
General Materials Science
Reference25 articles.
1. Cho, J.S., Jeong, H.S., Moon, J.T., Yoo, S.J., Seo, J.S., Lee, S.M., Ha, S.W., Her, E.K., Kang, S.H., and Oh, K.H. (2009, January 26–29). Thermal reliability & IMC behaviour of low cost alternative Au-Ag-Pd wire bonds to Al metallization. Proceedings of the 2009 59th Electronic Components and Technology Conference, San Diego, CA, USA. 2. Thermal conductivity and reliability reinforcement for sintered microscale Ag particle with AlN nanoparticles additive;Wang;Mater. Charact.,2023 3. Intermetallic Phase on the Interface of Ag-Au-Pd/Al Structure;Hsueh;Adv. Mater. Sci. Eng.,2014 4. Kinetics of Solid-State Reactive Diffusion between Au and Al;Minho;Mater. Trans.,2011 5. Jian, M., Hamasha, S., Alahmer, A., Hamasha, M., Wei, X., Belhadi, M.E.A., and Hamasha, K. (2023). Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions. Materials, 16.
|
|