Effect of Ce Addition on Microstructure, Thermal Conductivity, and Mechanical Properties of As-Cast and As-Extruded Mg–3Sn Alloys

Author:

He Fei-yu12,Hu Wen-xin12,Liu Li-juan3,He Wei12,Ma Shao-bo12,Zhang Xu-dong12,Yang Zheng-hua12,Wang Wei12

Affiliation:

1. National Key Laboratory of Baiyunobo Rare Earth Resource Researches and Comprehensive Utilization, Baotou 014030, China

2. Baotou Research Institute of Rare Earths, Baotou 014030, China

3. Technical Center of Steel Union Co., Ltd. of Baotou Steel (Group) Corp, Baotou 014010, China

Abstract

In the present research, the impacts of Ce additions at various concentrations (0, 1.0, 3.4, and 4.0 wt.%) on the evolution of the microstructure, mechanical properties, and thermal conductivity of as-cast and as-extruded Mg-3Sn alloys were investigated. The findings demonstrate that adding Ce caused the creation of a new ternary MgSnCe phase in the magnesium matrix. Some new Mg17Ce2 phases are generated in the microstructure when Ce levels reach 4%. The thermal conductivity of the Mg-3Sn alloy is significantly improved due to Ce addition, and the Mg-3Sn-3.4Ce alloy exhibits the highest thermal conductivity, up to 133.8 W/(m·K) at 298 K. After extrusion, both the thermal conductivity and mechanical properties are further improved. The thermal conductivity perpendicular to the extrusion direction of Mg-3Sn-3.4Ce alloy could achieve 136.28 W/(m·K), and the tensile and yield strengths reach 264.3 MPa and 227.2 MPa, with an elongation of 7.9%. Adding Ce decreases the dissolved Sn atoms and breaks the eutectic α-Mg and Mg2Sn network organization, leading to a considerable increase in the thermal conductivity of as-cast Mg-3Sn alloys. Weakening the deformed grain texture contributed to the further enhancement of the thermal conductivity after extrusion.

Funder

National Key Research and Development Project

Project of State Key Laboratory of Baiyunobo Rare Earth Resource Researches and Comprehensive Utilization

Natural Science Foundation of Inner Mongolia

Publisher

MDPI AG

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