Effect of a Gradient Temperature Rolling Process on the Microstructure and Mechanical Properties of the Center of Ultra-Heavy Plates

Abstract

As there is a small amount of deformation in the center during the rolling process of ultra-heavy plates, it is extremely easy to cause poor mechanical properties in the center. Increasing the deformation in the center is the most feasible method to eliminate the deformation effects in the cross-section of ultra-heavy plates. In this study, the gradient temperature rolling (GTR) process is compared with the traditional uniform temperature rolling (UTR) process. It is found that the GTR process can significantly increase the deformation in the center and thereby refine the grains. The room temperature tensile test and instrumented Charpy impact test are used to test the strength at room temperature and impact energy at low temperature. Combined with the obtained impact load/energy displacement curve, the deformation and damage process under impact load are analyzed. The microstructure morphology and impact fracture obtained by different rolling processes in the center are analyzed by experimental methods such as OM, SEM, EBSD, etc. The prior austenite grain (PAG) boundary morphology is analyzed and the densities of grain boundaries are statistically quantified. The results showed that the strength, plasticity, and low-temperature toughness of the GTR process are improved compared to the UTR process, with increased dislocation density in the center microstructure, the density of PAG boundaries, and the density of packet boundaries. The size of the PAG in the center is refined by ~49%, the density of PAG boundaries increased by ~140%, the density of high-angle packet boundaries increased by ~39%, and the density of low-angle packet boundaries increased by ~49%. The crack propagation in the instrumented Charpy impact test of the GTR process showed stable expansion, indicating a ductile fracture compared to the semi-brittle fracture of the UTR process. The densities of PAG boundaries and high-angle packet boundaries are the most important factors affecting the strength and low-temperature toughness.