Properties of Light Cementitious Composite Materials with Waste Wood Chips

Author:

Guo Huijuan,Wang Peihan,Li Qiuyi,Liu Guoying,Fan Qichang,Yue Gongbing,Song Shuo,Zheng Shidong,Wang Liang,Guo Yuanxin

Abstract

The CO2 emissions from the cement industry and the production of waste wood chips are increasing with the rapid growth of the construction industry. In order to develop a green environmental protection building material with low thermal conductivity and up to standard mechanical properties, in this study, pine waste wood chips were mixed into cement-based materials as fine aggregate, and three different kinds of cementitious binders were used, including sulfur aluminate cement (SAC), ordinary Portland cement (OPC), and granulated blast furnace slag (GBFS), to prepare a recycled light cementitious composite material. The mechanical, thermal conductivity, shrinkage, water absorption, and pore structure of a wood chip light cementitious composite material were studied by changing the Ch/B (the mass ratio of wood chip to binder). The results showed that the strength, dry density, and thermal conductivity of the specimens decreased significantly with the increase in the Ch/B, while the shrinkage, water absorption, and pore size increased with the increase in the Ch/B. By comparing three different kinds of cementitious binders, the dry density of the material prepared with OPC was 942 kg/m3, the compressive strength of the material prepared with SAC was 13.5 MPa, and the thermal conductivity of the material prepared with slag was the lowest at 0.15 W/m/K. From the perspective of low-cost and low-carbon emissions, it was determined that the best way to prepare a light cementitious composite with waste wood chips is to use granulated blast furnace slag (GBFS) as the cementitious binder.

Funder

National Natural Science Foundation of China

Natural Science Foundation of Shandong Province

Municipal School Enterprise Cooperation Project

Qingdao Municipal Government Procurement Project

Qingdao Science and Technology Demonstration and Guidance Project

Publisher

MDPI AG

Subject

General Materials Science

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