Effects of Dry Density and Moisture Content on the Kaolin–Brass Interfacial Shear Adhesion

Author:

Almasoudi Rayed12,Abuel-Naga Hossam1,Daghistani Firas13ORCID

Affiliation:

1. Department of Civil Engineering, La Trobe University, Bundoora, VIC 3086, Australia

2. Department of Civil Engineering, Umm Al-Qura University, Makkah 24381, Saudi Arabia

3. Department of Civil Engineering, University of Business and Technology, Jeddah 23435, Saudi Arabia

Abstract

Kaolin clay, with its consistent properties, fine particle size, high surface area, and extensive historical use, stands out as a reliable choice for laboratory research. This study aims to assess the interface shear adhesion behaviour between compacted clay and a metallic surface. For this purpose, a new testing approach was developed. The proposed method is simple, requires neither advanced equipment nor specialised test procedures, and, thus, represents an improvement over existing practices in this field. The experimental program focuses on determining the interface shear adhesion strength between reconstituted kaolin clay and a metallic surface. The kaolin clay testing specimens were dynamically compacted at various energy levels and moisture contents. The results indicate that the optimum moisture content is 30%, which provides the highest density to the sample and divides the compaction curve into dry and wet sides. Furthermore, the results demonstrate that the interface shear adhesion strength increases with the clay’s dry density. Conversely, there is a significant decrease in strength as the moisture content specifically rises on the wet side of the compaction curve. The adhesion behaviour was also attributed to matric suction, where high suction enhanced interfacial adhesion, while low suction weakened bonding and diminished adhesion. Additionally, this study presents a unique three-dimensional contour graph illustrating the combined effects of dry density and moisture content on the interfacial adhesion.

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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