Material Removal Characteristics of Spherical-Array-Focused Ultrasonic Abrasive Machining

Abstract

To improve the ultrasonic energy and realize far-field ultrasonic abrasive machining of complex surfaces, a spherical-array-focused ultrasonic abrasive machining system was established. By combining ultrasonic field simulation, detection and a single-factor experiment, the influences of the ultrasonic generator current, abrasive concentration, and particle size on the material removal properties and surface quality evolution of quartz glass were investigated. When the current was less than 0.4 A, the material removal showed plastic removal at the nanoscale. When the current was more than 0.5 A, the cavitation phenomenon formed micron-scale impact removal traces on the workpiece surface. The increase in abrasive concentration increased the impact density and material removal rate, while excessive abrasive concentration increased the impeding effect between abrasive particles and reduced the material removal rate. Moreover, the increase in abrasive particle concentration enhanced heterogeneous cavitation nucleation, promoted the removal of abrasive impact materials under the action of a cavitation jet, and inhibited the removal of direct surface cavitation. The abrasive particle size affects the heterogeneous cavitation nucleation and the acceleration of the cavitation jet on abrasive particles, which affects the material removal rate and surface quality. By controlling the energy of the focused ultrasound and abrasive parameters, the plastic or brittle domain removal of quartz glass can be achieved at the micro- and nanoscales.