WEDM of Copper for the Fabrication of Large Surface-Area Micro-Channels: A Prerequisite for the High Heat-Transfer Rate

Author:

Ahmed NaveedORCID,Mughal Mohammad Pervez,Shoaib Waqar,Farhan Raza Syed,Alahmari Abdulrhman M.

Abstract

To get the maximum heat transfer in real applications, the surface area of the micro-features (micro-channels) needs to be large as possible. It can be achieved by producing a maximum number of micro-channels per unit area. Since each successive pair of the micro-channels contain an inter-channels fin, therefore the inter-channels fin thickness (IFT) plays a pivotal role in determining the number of micro-channels to be produced in the given area. During machining, the fabrication of deep micro-channels is a challenge. Wire-cut electrical discharge machining (EDM) could be a viable alternative to fabricate deep micro-channels with thin inter-channels fins (higher aspect ratio) resulting in larger surface area. In this research, minimum IFT and the corresponding machining conditions have been sought for producing micro-channels in copper. The other attributes associated with the micro-channels have also been deeply investigated including the inter-channels fin height (IFH), inter-channels fin radius (IFR) and the micro-channels width (MCW). The results reveal that the inter-channels fin is the most critical feature to control during the wire electrical discharge machining (WEDM) of copper. Four types of fin shapes have been experienced, including the fins: broken at the top end, deflected at the top end, curled bend at the top, and straight with no/negligible deflection.

Funder

King Saud University

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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