Hot Deformation Behavior and Microstructure Evolution of a Graphene/Copper Composite

Abstract

Graphene/copper composites are promising in electronic and energy fields due to their superior conductivity, but microstructure control during thermal mechanical processing (TMP) remains a crucial issue for the manufacturing of high-performance graphene/copper composites. In this study, the hot deformation behavior of graphene/copper composites was investigated by isothermal compression tests at deformation temperatures of 700~850 °C and strain rates of 0.01~10 s−1, and a constitutive equation based on the Arrhenius model and hot processing map was established. Results demonstrate that the deformation mechanism of the graphene/copper composites mainly involves dynamic recrystallization (DRX), and such DRX-mediated deformation behavior can be accurately described by the established Arrhenius model. In addition, it was found that the strain rate has a stronger impact on the DRX grain size than the deformation temperature. The optimum deformation temperature and strain rate were determined to be 800 °C and 1 s−1, respectively, with which a uniform microstructure with fine grains can be obtained.