A Small Database with an Adaptive Data Selection Method for Solder Joint Fatigue Life Prediction in Advanced Packaging
Author:
Affiliation:
1. Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu City 30013, Taiwan
2. Department of Mechanical and Computer-aided Engineering, Feng Chia University, Taichung 407102, Taiwan
Abstract
Funder
National Tsing Hua University, Taiwan
Semiconductor Research Corporation
Publisher
MDPI AG
Link
https://www.mdpi.com/1996-1944/17/16/4091/pdf
Reference30 articles.
1. Lui, T.C., and Muthuraman, B.N. (2016, January 21–23). Relibability assessment of wafer level chip scale package (WLCSP) based on distance-to-neutral point (DNP). Proceedings of the 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Budapest, Hungary.
2. Enhancing the reliability of wafer level packaging by using solder joints layout design;Liu;IEEE Trans. Compon. Packag. Technol.,2006
3. Tsou, C., Chang, T., Wu, K., Wu, P., and Chiang, K. (2017, January 19–22). Reliability assessment using modified energy based model for WLCSP solder joints. Proceedings of the 2017 International Conference on Electronics Packaging (ICEP), Tendo, Japan.
4. Kuo, H., Lai, B., and Chiang, K. (2020, January 21–23). Study on Reliability Assessment of Wafer Level Package Using Design-on-Simulation with Support Vector Regression Techniques. Proceedings of the 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan.
5. Durga, S., Iyer, R., Ramakrishnan, G., and De, A. (2021, January 18–24). Training data subset selection for regression with controlled generalization error. Proceedings of the International Conference on Machine Learning, Online.
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