A Small Database with an Adaptive Data Selection Method for Solder Joint Fatigue Life Prediction in Advanced Packaging

Author:

Su Qinghua1,Yuan Cadmus2ORCID,Chiang Kuo-Ning1ORCID

Affiliation:

1. Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu City 30013, Taiwan

2. Department of Mechanical and Computer-aided Engineering, Feng Chia University, Taichung 407102, Taiwan

Abstract

There has always been high interest in predicting the solder joint fatigue life in advanced packaging with high accuracy and efficiency. Artificial Intelligence Plus (AI+) is becoming increasingly popular as computational facilities continue to develop. This study will introduce machine learning (a core component of AI). With machine learning, metamodels that approximate the attributes of systems or functions are created to predict the fatigue life of advanced packaging. However, the prediction ability is highly dependent on the size and distribution of the training data. Increasing the amount of training data is the most intuitive approach to improve prediction performance, but this implies a higher computational cost. In this research, the adaptive sampling methods are applied to build the machine learning model with a small dataset sampled from an existing database. The performance of the model will be visualized using predefined criteria. Moreover, ensemble learning can be used to improve the performance of AI models after they have been fully trained.

Funder

National Tsing Hua University, Taiwan

Semiconductor Research Corporation

Publisher

MDPI AG

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3