Energy Saving Potential of PCMs in Buildings under Future Climate Conditions

Author:

Gassar Abdo Abdullah Ahmed,Yun Geun YoungORCID

Abstract

Energy consumption reduction under changing climate conditions is a major challenge in buildings design, where excessive energy consumption creates an economic and environmental burden. Improving thermal performance of the buildings through support applying phase change material (PCM) is a promising strategy for reducing building energy consumption under future climate change. Therefore, this study aims to investigate the energy saving potentials in buildings under future climate conditions in the humid and snowy regions in the hot continental and humid subtropical climates of the east Asia (Seoul, Tokyo and Hong Kong) when various PCMs with different phase change temperatures are applied to a lightweight building envelope. Methodology in this work is implemented in two phases: firstly, investigation of energy saving potentials in buildings through inclusion of three types of PCMs with different phase temperatures into the building envelop separately and use weather file in the present (2017); and, secondly, evaluation of the effect of future climate change on the performance of PCMs by analyzing energy saving potentials of PCMs with 2020, 2050 and 2080 weather data. The results show that the inclusion of PCM into the building envelope is a promising strategy to increase the energy performance in buildings during both heating and cooling seasons in Seoul, Tokyo and Hong Kong under future climate conditions. The energy savings achieved by using PCMs in those regions are electricity savings of 4.48–8.21%, 3.81–9.69%, and 1.94–5.15%, and gas savings of 1.65–16.59%, 7.60–61.76%), and 62.07–93.33% in Seoul, Tokyo and Hong Kong, respectively, for the years 2017, 2020, 2050 and 2080. In addition, BioPCM and RUBITHERMPCM are the most efficient for improving thermal performance and saving energy in buildings in the tested regions and years.

Funder

National Research Foundation of Korea

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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