Delamination Detection and Localization in Vibrating Composite Plates and Shells Using the Inverse Finite Element Method

Author:

Ganjdoust Faraz123ORCID,Kefal Adnan123ORCID,Tessler Alexander4

Affiliation:

1. Faculty of Engineering and Natural Sciences, Sabanci University, Tuzla, Istanbul 34956, Turkey

2. Integrated Manufacturing Technologies Research and Application Center, Sabanci University, Tuzla, Istanbul 34956, Turkey

3. Composite Technologies Center of Excellence, Istanbul Technology Development Zone, Sabanci University-Kordsa Global, Pendik, Istanbul 34906, Turkey

4. Structural Mechanics and Concepts Branch, NASA Langley Research Center, Mail Stop 190, Hampton, VA 23681-2199, USA

Abstract

Delamination damage is one of the most critical damage modes of composite materials. It takes place through the thickness of the laminated composites and does not show subtle surface effects. In the present study, a delamination detection approach based on equivalent von Mises strains is demonstrated for vibrating laminated (i.e., unidirectional fabric) composite plates. In this context, the governing relations of the inverse finite element method were recast according to the refined zigzag theory. Using the in situ strain measurements obtained from the surface and through the thickness of the composite shell, the inverse analysis was performed, and the strain field of the composite shell was reconstructed. The implementation of the proposed methodology is demonstrated for two numerical case studies associated with the harmonic and random vibrations of composite shells. The findings of this study show that the present damage detection method is capable of real-time monitoring of damage and providing information about the exact location, shape, and extent of the delamination damage in the vibrating composite plate. Finally, the robustness of the proposed method in response to resonance and extreme load variations is shown.

Funder

Scientific and Technological Research Council of Turkey

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

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