Multi-Body Dynamic Analysis of Hydrostatic Bearing with the MMC Material in Micro-Nano Machining

Author:

Khaghani Ali1ORCID,Ivanov Atanas1,Cheng Kai1

Affiliation:

1. Department of Mechanical and Aerospace Engineering (MAE), Brunel University London, Uxbridge UB8 3PH, UK

Abstract

This study focuses on the analysis of a linear hydrostatic bearing using harmonic frequency response and harmonic response simulations. The aim is to evaluate the feasibility of replacing the existing alloy steel material with a metal matrix composite (MMC) in terms of its performance and dynamic characteristics for both the base and carriage parts. The simulation results indicate that the MMC material exhibits higher resonant frequencies and improved damping capabilities compared to the structural steel material. The higher resonant frequencies observed in the MMC material are attributed to its stiffness and structural properties. These properties contribute to increased natural frequencies and improved vibration damping characteristics. This suggests that incorporating the MMC material in the bearing design could enhance motion control, improving the ability to precisely control and manipulate the movement of components or systems. In the context of ultraprecision machining applications, incorporating the MMC material in the hydrostatic bearing design can also lead to a more accurate and controlled motion, resulting in improved precision and finer machining outcomes. The displacement analysis confirms that both materials meet the specifications provided by the manufacturer, supporting the viability of using MMC as an alternative. However, further experimental validation and considerations of material feasibility, manufacturing factors, and cost-effectiveness are necessary before implementing the MMC material in practical applications. Overall, this research highlights the potential benefits of MMC in the design of linear hydrostatic bearings, paving the way for enhanced performance in ultraprecision machining processes.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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