Design Guidelines for Thin Diaphragm-Based Microsystems through Comprehensive Numerical and Analytical Studies

Author:

Belwanshi Vinod12ORCID,Rane Kedarnath3,Kumar Vibhor4,Pramanick Bidhan5ORCID

Affiliation:

1. CSIR-National Metallurgical Laboratory, Jamshedpur 831007, India

2. School of Physics and Astronomy, University of Glasgow, Glasgow G12 8QQ, UK

3. National Manufacturing Institute Scotland Renfrew, Renfrew PA4 9PA, UK

4. School of Engineering, Rutgers, The State University of New Jersey, Piscataway, NJ 08854, USA

5. School of Electrical Sciences, Center of Excellence in Particulates Colloids and Interfaces, Indian Institute of Technology Goa, Ponda 403401, India

Abstract

This paper presents comprehensive guidelines for the design and analysis of a thin diaphragm that is used in a variety of microsystems, including microphones and pressure sensors. It highlights the empirical relations that can be utilized for the design of thin diaphragm-based microsystems (TDMS). Design guidelines developed through a Finite Element Analysis (FEA) limit the iterative efforts to fabricate TDMS. These design guidelines are validated analytically, with the assumption that the material properties are isotropic, and the deviation from anisotropic material is calculated. In the FEA simulations, a large deflection theory is taken into account to incorporate nonlinearity, such that a critical dimensional ratio of a/h or 2r/h can be decided to have the linear response of a thin diaphragm. The observed differences of 12% in the deflection and 13% in the induced stresses from the analytical calculations are attributed to the anisotropic material consideration in the FEA model. It suggests that, up to a critical ratio (a/h or 2r/h), the thin diaphragm shows a linear relationship with a high sensitivity. The study also presents a few empirical relations to finalize the geometrical parameters of the thin diaphragm in terms of its edge length or radius and thickness. Utilizing the critical ratio calculated in the static FEA analysis, the basic conventional geometries are considered for harmonic analyses to understand the frequency response of the thin diaphragms, which is a primary sensing element for microphone applications and many more. This work provides a solution to microelectromechanical system (MEMS) developers for reducing cost and time while conceptualizing TDMS designs.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Reference43 articles.

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2. Tiete, J., Domínguez, F., da Silva, B., Touhafi, A., and Steenhaut, K. (2017). Wireless MEMS Networks and Applications, Woodhead Publishing.

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5. Zinserling, B. (2007). Silicon-based MEMS Microphone For Automotive Applications. MicroNano News, 8–11. Available online: http://www.onboard-technology.com/pdf_febbraio2007/020705.pdf.

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