Longitudinal Ultrasonic Vibration-Assisted Planing Method for Processing Micro-Pyramid Arrays

Abstract

Micro-pyramid copper molds are critical components in the preparation of high-precision optical elements, such as light-trapping films and reflective films. Their surfaces are composed of micro-pyramid arrays (MPAs). The surface roughness and edge burrs of MPAs seriously affect the optical properties of optical elements. To reduce the surface roughness, as well as the sizes of the edge burrs, the longitudinal ultrasonic vibration-assisted planing (LUVP) method for processing MPAs was developed during this study. In addition, an experiment was conducted to compare the precision planing and LUVP methods of MPA generation. The results show that the tool nose amplitude of the LUVP experimental platform constructed during this study was 3.3 μm, and that the operating frequency was 19.85 kHz. An MPA processed by LUVP had a smaller surface roughness than that of an MPA produced by precision planing; it also had fewer and smaller edge burrs, and there was slightly less diamond tool wear. The MPA cut using the LUVP method had no corrugation on its surface. This research lays a foundation for developing higher-precision micro-pyramid plastic films.