Evaluation of Cost-Effective Modified Binder Thin Chip and Cape Seal Surfacings on an Anionic Nano-Modified Emulsion (NME)-Stabilised Base Layer Using Accelerated Pavement Testing (APT)

Author:

Jordaan Gerrit J.ORCID,Steyn Wynand J. vd M.ORCID,Broekman AndreORCID

Abstract

Emulsion stabilisation of base layers surfaced with chip seals often proves problematic, with chips punching into the base and early distress. This can be aggravated by the use of modified binders that restricts the evaporation of moisture from pavement layers. The introduction of new-age (nano)-modified emulsion (NME) stabilisation has the advantage that water is chemically repelled from the stabilised layer, resulting in an accelerated development of strength. A need was identified to evaluate the early-life performance of selected chip and Cape seals, together with identified modified binders on anionic NME-stabilised base layers constructed with materials traditionally classified as unsuitable, using archaic empirically derived tests. Three different chip seal surfacings with unconventional modified binders were constructed and evaluated using accelerated pavement testing (APT) with the Model Mobile Load Simulator—3rd model (MMLS3). The objectives of the experimental design and testing were to evaluate the binder performance, chip seal performance in terms of early loss of chips before chip orientation, punching of the chips into the anionic NME-stabilised base and deformation characteristics of a Cape seal that was hand-laid using an anionic NME slurry without any cement filler. It was shown that that chip seal surfacings can be used at low risk, on a base layer containing materials with fines exceeding 22%. The selection of specific modified binders can reduce risks associated with chip seal surfacings, which can impact construction limitations. The recommended use of elastomer-modified binders on newly constructed or rehabilitated layers, resulting in moisture entrapment, needs to be reconsidered.

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

Reference37 articles.

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