Thermal Assessment of Dielectric Microspacer Technology Using an Advanced Three-Dimensional Simulation Model

Abstract

Dielectric microspacers (DMS) are a novel micro-technology that can be used to achieve a fixed micron/sub-micron gap distance between two separated surfaces, such as the emitter (cathode) and the PV cell (anode) of a near-field thermophotovoltaic converter (TPV). One of the system’s challenges is the flow of undesirable excess thermal energy from the cathode to the anode that might cause the PV cell to overheat. This work investigates the possibility of integrating this technology into a hybrid thermionic-photovoltaic (TIPV) converter operating at ultra-high temperatures (>1000 °C) without any risk of collector’s overheating, which might lead to its mechanical failure. A steady-state 3-D CFD model was developed in Fluent v17.1 solver to assess the system’s thermal behavior when the two electrodes were separated by a distance of 8–10 μm. The heat transfer through conduction across the system components and the net photon/electron flux between the two electrodes were simulated. Different cathode temperatures within the range of 1500–2500 K and various DMS shapes (capillary, cylindrical), patterns (e.g., ring-shaped) and sizes were studied. Results show that thermal performance is not affected by the DMS pattern, even for thermal conductivities of 80 W/(m·K), whereas the possibility of mechanical failure is considerable for Tcathode > 2000 K.