Nano-Modified Meta-Aramid Insulation Paper with Advanced Thermal, Mechanical, and Electrical Properties

Abstract

Molecular dynamics simulations were used to analyze the internal mechanism for the observed improvement in performance of nano-modified meta-aramid insulation paper from a microscopic point of view. The results showed that the k-polyphenylsilsesquioxane(PPSQ) modified meta-aramid insulation paper was superior to b-PPSQ modified meta-aramid insulation paper in terms of its thermal stability and mechanical and electrical properties. The analysis of microscopic parameters showed that the stiffness of k-PPSQ was less than that of b-PPSQ, and the hydroxyl groups on the open-loop system were more likely to enter the dispersed system, resulting in higher bonding strength, meta-aramid fiber chains between k-PPSQ molecules, and the formation of hydrogen bonds. Additionally, the nano-enhancement effects of k-PPSQ and b-PPSQ resulted in various improvements, including a reduction in pores between molecules in the blend model, an increase in the contact area, the formation of interfacial polarization, and a reduction in defects at the interface.