Three-Dimensional Columnar Microstructure Representation Using 2D Electron Backscatter Diffraction Data for Additive-Manufactured Haynes®282®

Author:

Zaikovska Liene1ORCID,Ekh Magnus2ORCID,Moverare Johan13ORCID

Affiliation:

1. Department of Engineering Science, University West, SE-461 86 Trollhättan, Sweden

2. Department of Material and Computational Mechanics, Chalmers University of Technology, SE-412 06 Gothenburg, Sweden

3. Department of Management and Engineering, Linköping University, SE-581 83 Linköping, Sweden

Abstract

This study provides a methodology for exploring the microstructural and mechanical properties of the Haynes®282® alloy produced via the Powder Bed Fusion-Electron Beam (PBF-EB) process. Employing 2D Electron Backscatter Diffraction (EBSD) data, we have successfully generated 3D representations of columnar microstructures using the Representative Volume Element (RVE) method. This methodology allowed for the validation of elastic properties through Crystal Elasticity Finite Element (CEFE) computational homogenization, revealing critical insights into the material behavior. This study highlights the importance of accurately representing the grain morphology and crystallographic texture of the material. Our findings demonstrate that created virtual models can predict directional elastic properties with a high level of accuracy, showing a maximum error of only ~5% compared to the experimental results. This precision underscores the potential of our approach for predictive modeling in Additive Manufacturing (AM), specifically for materials with complex, non-homogeneous microstructures. It can be concluded that the results uncover the intricate link between microstructural features and mechanical properties, underscoring both the challenges encountered and the critical need for the accurate representation of grain data, as well as the significance of achieving a balance in EBSD area selection, including the presence of anomalies in strongly textured microstructures.

Funder

Knowledge Foundation

Publisher

MDPI AG

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