Overview of Dynamic Bond Based Hydrogels for Reversible Adhesion Processes

Author:

Condò Ilaria1ORCID,Giannitelli Sara Maria2ORCID,Lo Presti Daniela13ORCID,Cortese Barbara4ORCID,Ursini Ornella4ORCID

Affiliation:

1. Department of Engineering, Università Campus Bio-Medico di Roma, Via Álvaro del Portillo 21, 00128 Rome, Italy

2. Department of Science and Technology for Sustainable Development and One Health, Università Campus Bio-Medico di Roma, Via Álvaro del Portillo 21, 00128 Rome, Italy

3. Fondazione Policlinico Universitario Campus Bio-Medico, Via Álvaro del Portillo 200, 00128 Rome, Italy

4. National Research Council—Institute of Nanotechnology (CNR-Nanotec), Università La Sapienza, c/o Edificio Fermi, Pz.le Aldo Moro 5, 00185 Rome, Italy

Abstract

Polymeric hydrogels are soft materials with a three-dimensional (3D) hydrophilic network capable of retaining and absorbing large amounts of water or biological fluids. Due to their customizable properties, these materials are extensively studied for developing matrices for 3D cell culture scaffolds, drug delivery systems, and tissue engineering. However, conventional hydrogels still exhibit many drawbacks; thus, significant efforts have been directed towards developing dynamic hydrogels that draw inspiration from organisms’ natural self-repair abilities after injury. The self-healing properties of these hydrogels are closely associated with their ability to form, break, and heal dynamic bonds in response to various stimuli. The primary objective of this review is to provide a comprehensive overview of dynamic hydrogels by examining the types of chemical bonds associated with them and the biopolymers utilized, and to elucidate the chemical nature of dynamic bonds that enable the modulation of hydrogels’ properties. While dynamic bonds ensure the self-healing behavior of hydrogels, they do not inherently confer adhesive properties. Therefore, we also highlight emerging approaches that enable dynamic hydrogels to acquire adhesive properties.

Publisher

MDPI AG

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