Production and Characterization of Cu/CNT Nanocomposites

Author:

Carneiro Íris12ORCID,Monteiro Beatriz1ORCID,Ribeiro Bernardo1ORCID,Fernandes José V.3ORCID,Simões Sónia12ORCID

Affiliation:

1. Department of Metallurgical and Materials Engineering (DEMM), University of Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal

2. Institute of Science and Innovation in Mechanical and Industrial Engineering (LAETA/INEGI), Rua Dr. Roberto Frias, 4200-465 Porto, Portugal

3. Centre for Mechanical Engineering, Materials and Processes (CEMMPRE), Department of Mechanical Engineering, University of Coimbra, Rua Luís Reis Santos, Pinhal de Marrocos, 3030-788 Coimbra, Portugal

Abstract

In this research, copper nanocomposites reinforced with carbon nanotubes (CNTs) were produced by ultrasonication and conventional sintering, followed by cold rolling. These nanocomposites may be good candidates due to their excellent properties for components in the electrical, electronics, or aerospace industries with highly demanding requirements. The main objectives of this work were to produce and characterize the Cu/CNT nanocomposites, identify the strengthening mechanisms, and study the deformation behavior of the nanocomposites during cold rolling. The nanocomposites exhibited an improvement in hardness and tensile strength of 17 and 67%, respectively, attesting to the strengthening effect of the reinforced material. The yield strength of the nanocomposites was determined considering different mechanisms: (1) load transfer, (2) grain refinement or texture, (3) dislocation, and (4) Orowan strengthening mechanisms. The microstructural and calculated results show that the mechanism that contributes the most to the increase in the properties of the nanocomposite is the load transfer. The nanocomposites show a different texture evolution of the Cu matrix during cold rolling. This can be due to differences in the active slip planes between the matrix and the nanocomposite, which affects the lattice rotation.

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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