Study on Interface Mechanical Properties of Graphene/Copper Matrix Composites

Author:

Li Dongbo1,Liu Yongkun1,Liu Qinlong1

Affiliation:

1. College of Science, Xi’an University of Architecture and Technology, Xi’an 710055, China

Abstract

Graphene/copper matrix composites have a wide range of application prospects, but the mechanical properties of the interface have been one of the key problems restricting their wide application. In this paper, the mechanical behaviors at the interface of graphene/copper matrix composites, such as pulling up, pulling out, and cohesion, and the effects of temperature and graphene content on them were studied by the molecular dynamics method. The results show that the pull-up force and cohesiveness show two stages in the whole process. The pulling force increases rapidly and then decreases to 0 slowly. The pull-out force shows three stages: it rises rapidly at first, then fluctuates continuously, and finally drops to 0. The mechanical properties of the interface deteriorated with the increase in temperature. When the temperature increased from 0 K to 1100 K, the interface normal strength, shear strength, and cohesion strength of the interface decreased by 26.3%, 32.9%, and 24.8%, respectively. In addition, with the increase in graphene content, the normal strength of the interface increases, the shear strength decreases, and the cohesion strength almost stays the same. When the graphene content increases from 6.71 at% to 11.75 at%, the normal strength increases by 6.8%, while the shear strength decreases by 37.4%. The influence mechanism of temperature and content is explained from the aspects of the influence of atomic thermal motion and the hindering effect of graphene on the dislocation motion of the copper matrix. The relevant results have certain reference values for the engineering application and theoretical research of graphene/copper composites.

Funder

National Science Foundation of China

Chinese Postdoctoral Science

Shaanxi Provincial Education Department

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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