Microstructure Evolution and Recrystallization Mechanisms of a Cu–Cr–Sn Alloy during Thermal Deformation Process

Abstract

Thermal deformation behavior of Cu–Cr–Sn alloy ingots under deformation temperatures ranging from 600 °C to 950 °C and strain rates from 0.01 s−1 to 10 s−1 was investigated in detail. The thermal deformation constitutive equation and thermal processing map of the alloy were established, respectively. The activation energy Q was determined as 430.61 KJ/mol. The optimal deformation system corresponding to the hot working diagram was a deformation temperature of 900 °C and strain rate of 0.1 s−1. Under these deformation conditions, twin dynamic recrystallization (TDRX), continuous dynamic recrystallization (CDRX), and discontinuous dynamic recrystallization (DDRX) occurred simultaneously, with the twinning process causing the stress–strain curve to exhibit a wavy change. The thermal deformation microstructure of the alloy is co-regulated by different recrystallization mechanisms, with DDRX occurring mainly at low deformation temperatures, and both CDRX and DDRX occurring at high deformation temperatures.