Studies on Hot-Rolling Bonding of the Al-Cu Bimetallic Composite

Abstract

Through the approaches in this article, an attempt was made to analyze the bonding of Al-Cu bimetallic composite layers and the highlight of the diffusion at the boundary between the layers, by hot rolling. An aluminum alloy 6060 plate (EN-AW AlMgSi) and a Cu-ETP ½ hard (CW004A) plate were used. All of these layers of materials were TIG-welded, at both ends, into a heat-treated layered composite and subsequently subjected to the hot-rolling process. The Al-Cu composite material obtained was analyzed by scanning electronic microscopy (SEM) analysis, after being subjected to the tensile test, as well as energy-dispersive X-ray (EDX) analysis. The obtained results highlighted the diffusion at the boundary between the layers of the Al-Cu composite as well as its ductile breakage and the distribution of the amount of Al and Cu at the interface of the layers.