Mini-Review of Best Practices for Greenhouse Gas Reduction in Singapore’s Semiconductor Industry

Abstract

Climate change is an urgent global concern driven by human activities and the subsequent rise in greenhouse gas (GHG) emissions. The semiconductor industry has emerged as a significant contributor to GHG emissions, yet there is a lack of clear guidelines for effective reduction methods specifically tailored to domestic and international semiconductor manufacturing. This mini-review addresses this gap by proposing implementation principles for optimal control technology aimed at mitigating GHG emissions in the semiconductor industry. Drawing upon guidance from the Intergovernmental Panel on Climate Change (IPCC) and established reduction methods, our focus is on the deployment of efficient exhaust gas destruction equipment for removing GHGs from critical processes such as Etching, ThinFilm (including chemical/physical vapor deposition), and Diffusion. By examining and consolidating current best practices, this review provides a foundation for developing comprehensive guidelines and standards that support the semiconductor industry’s transition to more sustainable operations. Considering the vast body of literature in this field, we highlight the significance of this study as it contributes to the ongoing research efforts in reducing GHG emissions. The objective of this study is to identify research gaps and motivate further investigations, while also providing practical recommendations for reducing GHG emissions in the semiconductor industry.