A Mobile Solution for Augmenting a Manufacturing Environment with User-Generated Annotations

Author:

He Fan,Ong S.K.ORCID,Nee A.Y.C.

Abstract

The ever-increasing complexity in manufacturing environments has caused delay and uncertainty for on-site personnel when retrieving critical information. Currently, information associated with manufacturing environments is created and stored in centralized terminals and even paper-based logbooks. Any delays in accessing this information can hinder critical decision-making processes that are essential to ensure maximum efficiency and productivity. To increase the competitiveness of manufacturing companies, the authors present a user-oriented markerless augmented reality authoring solution for the manufacturing environment utilizing the capability of a modern smartphone or head-mounted display. With a one-time setup and calibration, the end user is able to augment a physical workspace with a digital layer and annotate any stationary object with application data including maintenance records, service tickets, and usage logs. By directly mapping the data onto a relevant physical object, it allows more efficient reuse and better contextualization of manufacturing information. The backend expandable data structure also enhances extensibility so that the users can modify the digital layer with ease when the physical environment changes. This annotation tool defines a novel way of managing manufacturing information to help companies work more efficiently and effectively.

Publisher

MDPI AG

Subject

Information Systems

Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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2. User oriented smart connected product and smart environment: a systematic literature review;The International Journal of Advanced Manufacturing Technology;2023-12-14

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4. An empirical study of an MR-enhanced kinematic prototyping approach for articulated products;Advanced Engineering Informatics;2023-10

5. Augmented Reality Based Training Module for IC Engine Assembly and Disassembly;Journal of Physics: Conference Series;2023-09-01

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