Study on the Soy Protein-Based Wood Adhesive Modified by Hydroxymethyl Phenol
Author:
Publisher
MDPI AG
Subject
Polymers and Plastics,General Chemistry
Link
http://www.mdpi.com/2073-4360/8/7/256/pdf
Reference18 articles.
1. Investigation of soy protein-kymene®adhesive systems for wood composites
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3. A Soy Flour-Based Adhesive Reinforced by Low Addition of MUF Resin
4. A new formaldehyde-free wood adhesive from renewable materials
5. Soy-based adhesives with 1,3-dichloro-2-propanol as a curing agent;Rogers;Wood Fiber Sci.,2004
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