Development of Computational Approach for Analyzing In-Process Thermal-Mechanical Condition during Friction Stir Welding for Prediction of Material Bonding Defect

Abstract

Unlike the conventional fusion welding process, friction stir welding (FSW) relies on solid-state bonding (SSB) to join metal surfaces. In this study, a straightforward computational methodology is proposed for predicting the material bonding defects during FSW using quantitative evaluation of the in-process thermal-mechanical condition. Several key modeling methods are integrated for predicting the material bonding defects. FSW of AA2024 is taken as an example to demonstrate the performance of the computational analysis. The dynamic sticking (DS) model is shown to be able to predict the geometry of the rotating flow zone near the welding tool. Butting interface tracking (BIT) analysis shows a significant orientation change occurring to the original butting interface, owing to the material flow in FSW, which has a major impact on the bonding pressure at the butting interface. The evolution of the interfacial temperature and the interfacial pressure at the butting interface was obtained to analyze their roles in the formation of material bonding. Four bonding-quality indexes for quantifying the thermal-mechanical condition are tested to show their performance in characterizing the bonding quality during FSW. When the BQI is below a critical value, a bonding defect will be generated. The paper indicates that the simulation-based prediction of a material bonding defect is highly feasible if the developed methodology is extended to quantitatively determine the critical value of the bonding quality index for successful SSB for various alloys.