CMOS-Compatible Ultrathin Superconducting NbN Thin Films Deposited by Reactive Ion Sputtering on 300 mm Si Wafer

Author:

Yang Zihao1,Wei Xiucheng2,Roy Pinku3,Zhang Di4ORCID,Lu Ping5,Dhole Samyak3,Wang Haiyan4ORCID,Cucciniello Nicholas3ORCID,Patibandla Nag1,Chen Zhebo1,Zeng Hao2,Jia Quanxi3ORCID,Zhu Mingwei1

Affiliation:

1. Applied Materials Inc., Santa Clara, CA 95054, USA

2. Department of Physics, University at Buffalo—The State University of New York, Buffalo, NY 14260, USA

3. Department of Materials Design and Innovation, University at Buffalo—The State University of New York, Buffalo, NY 14260, USA

4. School of Materials Engineering, Purdue University, West Lafayette, IN 47907, USA

5. Sandia National Laboratories, Albuquerque, NM 87185, USA

Abstract

We report a milestone in achieving large-scale, ultrathin (~5 nm) superconducting NbN thin films on 300 mm Si wafers using a high-volume manufacturing (HVM) industrial physical vapor deposition (PVD) system. The NbN thin films possess remarkable structural uniformity and consistently high superconducting quality across the entire 300 mm Si wafer, by incorporating an AlN buffer layer. High-resolution X-ray diffraction and transmission electron microscopy analyses unveiled enhanced crystallinity of (111)-oriented δ-phase NbN with the AlN buffer layer. Notably, NbN films deposited on AlN-buffered Si substrates exhibited a significantly elevated superconducting critical temperature (~2 K higher for the 10 nm NbN) and a higher upper critical magnetic field or Hc2 (34.06 T boost in Hc2 for the 50 nm NbN) in comparison with those without AlN. These findings present a promising pathway for the integration of quantum-grade superconducting NbN films with the existing 300 mm CMOS Si platform for quantum information applications.

Funder

SUNY Applied Materials Research Institute

U.S. NSF

Publisher

MDPI AG

Subject

General Materials Science

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