Lignin as a High-Value Bioaditive in 3D-DLP Printable Acrylic Resins and Polyaniline Conductive Composite

Abstract

With increasing environmental awareness, lignin will play a key role in the transition from the traditional materials industry towards sustainability and Industry 4.0, boosting the development of functional eco-friendly composites for future electronic devices. In this work, a detailed study of the effect of unmodified lignin on 3D printed light-curable acrylic composites was performed up to 4 wt.%. Lignin ratios below 3 wt.% could be easily and reproducibly printed on a digital light processing (DLP) printer, maintaining the flexibility and thermal stability of the pristine resin. These low lignin contents lead to 3D printed composites with smoother surfaces, improved hardness (Shore A increase ~5%), and higher wettability (contact angles decrease ~19.5%). Finally, 1 wt.% lignin was added into 3D printed acrylic resins containing 5 wt.% p-toluensulfonic doped polyaniline (pTSA-PANI). The lignin/pTSA-PANI/acrylic composite showed a clear improvement in the dispersion of the conductive filler, reducing the average surface roughness (Ra) by 61% and increasing the electrical conductivity by an order of magnitude (up to 10−6 S cm−1) compared to lignin free PANI composites. Thus, incorporating organosolv lignin from wood industry wastes as raw material into 3D printed photocurable resins represents a simple, low-cost potential application for the design of novel high-valued, bio-based products.