Research on the Disassembly Process and Model of Waste Mobile Phone Circuit Board Components

Abstract

Dismantling the waste printed circuit boards (WPCBs) of obsolete mobile phones is essential for resource recycling and environmental protection. An automated WPCB disassembly equipment based on the hot-vibration process was designed and applied, with optimized process conditions of a heating temperature of 250 °C and an equipment amplitude of >3.66 mm. The dismantling rate for electronic components and metal shields was 98%, but disassembly of components with underfill was less effective. Both simulation and actual measurement results of the equipment’s thermal field showed that the temperature inside the disassembly bin was uniform, with a maximum temperature difference of 6–8 °C. The area of the low-temperature region accounted for approximately 5% of the total area. The acceleration ranged from 2.11 to 8.28 g when using the disassembly force model. This equipment and process can be applied to disassemble large quantities of WPCBs.