Baseline-Free Damage Imaging of Composite Lap Joint via Parallel Array of Piezoelectric Sensors

Author:

Barzegar Mohsen1ORCID,Ribeiro Artur L.1,Pasadas Dario J.1ORCID,Asokkumar Aadhik2,Raišutis Renaldas2ORCID,Ramos Helena G.1ORCID

Affiliation:

1. Instituto de Telecomunicações, Instituto Superior Técnico, Universidade de Lisboa, 1049-001 Lisbon, Portugal

2. Prof. K. Baršauskas Ultrasound Research Institute, Kaunas University of Technology, 51423 Kaunas, Lithuania

Abstract

This paper presents a baseline-free damage imaging technique using a parallel array of piezoelectric sensors and a control board that facilitates custom combinations of sensor selection. This technique incorporates an imaging algorithm that uses parallel beams for generation and reception of ultrasonic guided waves in a pitch–catch configuration. A baseline-free reconstruction algorithm for probabilistic inspection of defects (RAPID) algorithm is adopted. The proposed RAPID method replaces the conventional approach of using signal difference coefficients with the maximum signal envelope as a damage index, ensuring independence from baseline data. Additionally, conversely to the conventional RAPID algorithm which uses all possible sensor combinations, an innovative selection of combinations is proposed to mitigate attenuation effects. The proposed method is designed for the inspection of lap joints. Experimental measurements were carried out on a composite lap joint, which featured two dissimilar-sized disbonds positioned at the lap joint’s borderline. A 2D correlation coefficient was used to quantitatively determine the similarity between the obtained images and a reference image with correct defect shapes and locations. The results demonstrate the effectiveness of the proposed damage imaging method in detecting both defects. Additionally, parametric studies were conducted to illustrate how various parameters influence the accuracy of the obtained imaging results.

Funder

Instituto de Telecomunicações

Portuguese Science and Technology Foundation

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

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