Thermal Expansion Behavior of Co-Spray Formed Al-20Si/7075 Bimetallic Gradient Alloy

Abstract

Bimetallic gradient alloys have attracted research attention recently due to their potential applications in the aerospace and automobile industries. In this study, Al-20Si/7075 bimetallic gradient alloys were successfully manufactured by co-spray forming and the roll process. We investigated the thermal expansion behavior of the gradient alloy. It was found that the coefficients of thermal expansion increased with silicon content and increased temperature, reaching the highest point at 573 K, after which they decreased on account of the relaxation of residual thermal stress and the silicon desolvation from the supersaturated aluminum phase. The measured thermal expansion coefficient can be roughly predicted through the traditional theoretical models. Our results revealed the thermal expansion behavior of Al-20Si/7075 bimetallic gradient alloys and would improve the development of new type aluminum–silicon alloy for electronic packaging.