Direct Visualization of Organometallic Intermediates on Cu(111) with Bond-Resolving Non-Contact Atomic Force Microscopy

Author:

Hao Xiaoyu1,Li Yan1,Ji Hongyan1,Wang Tingting1ORCID,Fan Haolong1,Zhang Quanzhen1,Yang Huixia1,Liu Liwei1,Zhang Teng1ORCID,Wang Yeliang1

Affiliation:

1. School of Integrated Circuits and Electronics & Yangtze Delta Region Academy, Beijing Institute of Technology (BIT), Beijing 100081, China

Abstract

In this study, we investigated the surface-confined coupling reactions of 1,8-dibromobiphenylene (BPBr2) on Cu(111) to elucidate the details of the organometallic intermediates via Ullmann reactions. We used scanning tunneling microscopy (STM) to characterize the resulting organometallic intermediates. Moreover, submolecular resolution of the non-contact atomic force microscopy (nc-AFM) qPlus technique enables the bond-resolving within the organometallic dimer product. Our findings reveal the debromination of BPBr2 on Cu(111), leading to the formation of an organometallic dimer intermediate at room temperature. Through nc-AFM measurements, we confirm and visualize the formation of the C-Cu-C bond. These insights enhance our understanding of Ullmann reaction and hold potential implications for the design of novel two-dimensional electronic devices.

Funder

National Natural Science Foundation of China

National Key Research and Development Program of China

Publisher

MDPI AG

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