Effect of Deposition Pressure and Temperature on Tungsten Thin-Film Heater for Phase-Change Switch Applications

Abstract

Tungsten (W) film is increasingly utilized in various microheater applications due to its numerous advantages. These advantages include a high melting point, positive constant temperature coefficient of resistance (TCR), good mechanical stability, and compatibility with semiconductor processes. In this paper, deposition parameters for enhancing the properties of W film were investigated, and an optimized microheater was fabricated. It was found that the deposition temperature and pressure can modify the TCR to be negative or positive and the crystalline phase of W films to be alpha phases or mixed with beta phases. A W film deposited under 650 °C with a pressure of 1 pa has a positive TCR and pure alpha phase crystalline structure. We applied this optimized W film as a microheater in an RF phase-change switch (RFPCS), and the maximum voltage of the optimized W microheater increased by at least 48% in this work. By optimizing the microheater, the phase-change switch can be successfully actuated in both on and off states, demonstrated by the Raman results of the phase-change material. A voltage pulse of 20 V/200 ns was enough to turn the switch off with MΩ, and 11 V/3 μs could turn the switch on with 138 Ω. The optimized microheater and device can cycle 500 times without failure. The insertion loss and isolation of the device at 20 GHz was 1.0 dB and 22 dB.