Research on Heat Dissipation of Multi-Chip LED Filament Package

Abstract

By studying the substrate material, structure, chip distribution, and array form of the multi-chip light-emitting diode (LED) package, the heat-dissipation capacity of the LED package is improved. Finite element analysis and steady-state thermal analysis are used to simulate and analyze LED packages with different materials and structures. Using the theory of LED illuminance and uniformity, the illuminance of some structures is computed. The results show that the change of substrate material and structure can greatly impact heat dissipation, while changing array forms has little effect on heat dissipation. By improving the spatial distribution of the chip, the temperature superposition problem of the substrate is solved, and the illuminance and uniformity are improved while dissipating heat. The LED filaments of the combined, equidistant, chip-distribution mode have improved heat dissipation. The S-type equal difference has the highest illumination and high illumination uniformity.