NiTi–Cu Bimetallic Structure Fabrication through Wire Arc Additive Manufacturing

Abstract

This study endeavors to comprehensively explore and elucidate the seamless integration of NiTi shape memory alloys (SMAs) into multifaceted applications through the utilization of novel joining techniques. The primary focus lies in the utilization of wire arc additive manufacturing (WAAM) to deposit Nitinol (NiTi) onto Copper (Cu), thereby introducing a transformative approach for their integration into electro-mechanical systems and beyond. Through a detailed examination of the NiTi/Cu bimetallic junction, using advanced analytical techniques including SEM, XRD, and DSC analyses, this research aims to unravel the intricate complexities inherent within the interface. The SEM images and X-ray patterns obtained reveal a complex and nuanced interface characterized by a broad mixed zone comprising various constituents, including Ti(Ni,Cu)2, pure Cu, Ti2(Ni,Cu)3 precipitates, and Ni-rich NiTi precipitates. The DSC results, showcasing low-intensity broad peaks during thermal cycling, underscore the inherent challenges in demonstrating functional properties within the NiTi/Cu system. Recognizing the critical importance of an enhanced martensitic transformation, this study delves into the effects of heat treatment. Calorimetric curves post-annealing at 500 °C exhibit distinct transformation peaks, shedding light on the intricate influence of NiTi layer distribution within the junction. The optimal heat treatment parameters for NiTi/Cu junction restoration are meticulously explored and determined at 500 °C for a duration of 12 h. Furthermore, the study offers valuable insights into optimizing NiTi–Cu joints, with micro-hardness values reaching 485 HV and compressive strength scaling up to 650 MPa. These significant findings not only hold promise for diverse applications across various industries but also pave the way for further research directions and explorations into the realm of SMA integration and advanced joining methodologies.