Design and Optimization for Mounting Primary Mirror with Reduced Sensitivity to Temperature Change in an Aerial Optoelectronic Sensor

Author:

Zhang Meijun,Lu Qipeng,Tian Haonan,Wang Dejiang,Chen Cheng,Wang Xin

Abstract

In order to improve the image quality of the aerial optoelectronic sensor over a wide range of temperature changes, high thermal adaptability of the primary mirror as the critical components is considered. Integrated optomechanical analysis and optimization for mounting primary mirrors are carried out. The mirror surface shape error caused by uniform temperature decrease was treated as the objective function, and the fundamental frequency of the mirror assembly and the surface shape error caused by gravity parallel or vertical to the optical axis are taken as the constraints. A detailed size optimization is conducted to optimize its dimension parameters. Sensitivities of the optical system performance with respect to the size parameters are further evaluated. The configuration of the primary mirror and the flexure are obtained. The simulated optimization results show that the size parameters differently affect the optical performance and which factors are the key. The mirror surface shape error under 30 °C uniform temperature decrease effectively decreased from 26.5 nm to 11.6 nm, despite the weight of the primary mirror assembly increases by 0.3 kg. Compared to the initial design, the value of the system’s modulation transfer function (0° field angle) is improved from 0.15 to 0.21. Namely, the optical performance of the camera under thermal load has been enhanced and thermal adaptability of the primary mirror has been obviously reinforced after optimization. Based on the optimized results, a prototype of the primary mirror assembly is manufactured and assembled. A ground thermal test was conducted to verify difference in imaging quality at room and low temperature, respectively. The image quality of the camera meets the requirements of the index despite degrading.

Funder

National Natural Science Foundation of China

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

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