Facile Preparation of Highly Conductive Poly(amide-imide) Composite Films beyond 1000 S m−1 through Ternary Blend Strategy

Abstract

Highly conductive thin films with suitable mechanical performances play a significant role in modern electronic industry. Herein, a series of ternary conductive polymer composites were fabricated by incorporating carbon black (CB) into binary conductive polymer composites of poly(amide-imide) (PAI) and polyaniline (PANI) to enhance their mechanical and conductive properties simultaneously. By varying the composition of PAI/PANI/CB ternary films, the conductivity enhanced by two orders of magnitude compared with the sum of PAI/PANI and PAI/CB binary conductive polymer composites, and a high conductivity of 1160 S m−1 was achieved. The improved conductivity is mainly because much more continuous conductive networks were constructed in the ternary conductive polymer composites. With the help of the unusual morphology, the tensile strength was also enhanced by more than 80% from 21 to 38 MPa. The origin for the improved morphology was discussed for further improvement.